Item |
Gas emitted from the semiconductor manufacturing business |
Processing gas properties |
Mixed exhaust gas including HF, HNO3, NOx |
Processing gas flow rate |
20,000m3/h(NTP) |
Operating time |
24 hours continuous |
Hazardous gas removal type |
Alkaline scrubber and catalytic denitration |
Filler |
MIRAX FKP327 |
Residual heat utilization |
Heat recovery from exhaust gas via a heat exchanger |
Drainage flow rate |
1,200ℓ/h |
Exhaust gas |
NOx |
99% or more(Removal rate) |
HF |
1ppm or less |
NH3 |
10ppm or less |
Foot print |
30m × 15m × 20mH |